TECHNICAL SPECIFICATIONS
PRINTING | METRIC | IMPERIAL |
Minimum Trace Width | 0.2mm | 8mil |
Minimum Passive Size | 1005 | 0402 |
Minimum Pin-to-Pin Pitch | 0.65mm | 26mil |
Resistivity | 12mΩ/Sq @ 70um Height | 12mΩ/Sq @ 3mil Height |
Supplied Substrate Material | FR4 | FR4 |
Maximum Board Thickness | 3mm | 0.125" |
DRILLING | METRIC | IMPERIAL |
Spindle Speed (Max.) | 13,000 RPM | |
Power | 12V, 25W | |
Runout (TIR) | 0.076mm | 0.003" |
Shank Diameter | 3.175mm | 1/8" |
Supplied Substrate Material | FR1 | |
Bit Diameter (Max.) | 2mm | 0.078" |
Bit Length (Max.) | 38.1mm | 1.5" |
SOLDERING | METRIC | IMPERIAL |
Minimum Passive Size | 1005 | 0402 |
Minimum Pin-to-Pin Pitch | 0.5mm | 20mil |
Solder Paste Alloy | Sn42/Bi57.6/Ag0.4 | Sn42/Bi57.6/Ag0.4 |
Solder Wire Alloy | SnBiAg1 | SnBiAg1 |
Soldering Iron Temperature | 180-200°C | 355-390°F |
SOLDER COMPATIBILITY | Sn42/Bi57.6/Ag0.4 Solder | Sn63/Pb37 Solder |
Standard Ink | ✔ | ✘ |
Flexible Ink | ✔ | ✘ |
Copper PCBs | ✔ | ✔ |
HASL PCBs | ✘ | ✔ |
Footprint and Print Bed | METRIC | IMPERIAL |
Dimensions (L × W × H) | 390mm × 257mm × 207mm | 15.4" × 10.1" × 8.2" |
Weight | 7kg | 15.4lbs |
Print Area | 128mm × 116mm | 5" × 4.5" |
Max. Heated Bed Temperature | 240°C | 464°F |
Software Requirements | Operating Systems | Windows 7, 8, 10 (64bit), OSX 10.11+ |
Compatible File Format | Gerber | |
Connection Type | Wired USB 2.0 |